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Power Transistors
2SD2000
Silicon NPN triple diffusion planar type
Unit: mm
0.70.1
For power switching I Features
* High-speed switching * Satisfactory linearity of forward current transfer ratio hFE * Large collector power dissipation PC * Full-pack package which can be installed to the heat sink with one screw
10.00.2 5.50.2
4.20.2 2.70.2
7.50.2
16.70.3
3.10.1
4.20.2
Solder Dip (4.0)
1.40.1
1.30.2 0.5+0.2 -0.1
14.00.5
0.80.1
I Absolute Maximum Ratings TC = 25C
Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Peak collector current Collector current Base current Collector power dissipation TC = 25C Ta = 25C Tj Tstg Symbol VCBO VCEO VEBO ICP IC IB PC Rating 80 60 6 8 4 1 35 2 150 -55 to +150 C C Unit V V V A A A W
123
2.540.3 5.080.5
1: Base 2: Collector 3: Emitter EIAJ: SC-67 TO-220F Package
Junction temperature Storage temperature
I Electrical Characteristics TC = 25C
Parameter Collector cutoff current Emitter to base current Collector to emitter voltage Forward current transfer ratio Symbol ICBO IEBO VCEO hFE1
*
Conditions VCB = 80 V, IE = 0 VEB = 6 V, IC = 0 IC = 25 mA, IB = 0 VCE = 4 V, IC = 1 A VCE = 4 V, IC = 4 A VCE = 4 V, IC = 4 A IC = 4 A, IB = 0.4 A VCE = 12 V, IC = 0.2 A, f = 10 MHz IC = 4 A, IB1 = 0.4 A, IB2 = - 0.4 A, VCC = 50 V
Min
Typ
Max 100 100
Unit A A V
60 70 20 2.0 1.5 80 0.3 1.0 0.2 250
hFE2 Base to emitter saturation voltage Collector to emitter saturation voltage Transition frequency Turn-on time Storage time Fall time Note) *: Rank classification Rank hFE1 Q 70 to 150 P 120 to 250 VBE(sat) VCE(sat) fT ton tstg tf
V V MHz s s s
1
2SD2000
PC T a
40 4 (1) (1) TC=Ta (2) With a 100 x 100 x 2mm Al heat sink (3) With a 50 x 50 x 2mm Al heat sink (4) Without heat sink (PC=2W) IB=40mA TC=25C
Power Transistors
IC VCE
Collector to emitter saturation voltage VCE(sat) (V)
100 IC/IB=10 30 10 3 1 0.3 TC=100C 0.1 0.03 0.01 0.01 0.03 25C -25C
VCE(sat) IC
Collector power dissipation PC (W)
35 30 25 20 15 10 5 0 0
35mA
Collector current IC (A)
3
30mA 25mA 20mA
2
15mA 10mA
(2) (3) (4)
1
5mA
0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 7 8
0.1
0.3
1
3
10
Ambient temperature Ta (C)
Collector to emitter voltage VCE (V)
Collector current IC (A)
VBE(sat) IC
100 104 IC/IB=10 30 10 3 1 0.3 0.1 0.03 0.01 0.01 0.03 TC=-25C 100C 25C
hFE IC
1000 VCE=4V
fT I C
VCE=12V f=10MHz TC=25C 100
Base to emitter saturation voltage VBE(sat) (V)
Forward current transfer ratio hFE
103 TC=100C 102
Transition frequency fT (MHz)
3 10
25C
-25C
10
10
1
0.1
0.3
1
3
10
1 0.01 0.03
0.1
0.3
1
0.1 0.01 0.03
0.1
0.3
1
3
10
Collector current IC (A)
Collector current IC (A)
Collector current IC (A)
Cob VCB
10000 100 IE=0 f=1MHz TC=25C
ton, tstg, tf IC
Pulsed tw=1ms Duty cycle=1% IC/IB=10 (IB1=-IB2) VCC=50V TC=25C
Area of safe operation (ASO)
100 30 Non repetitive pulse TC=25C ICP IC t=1ms DC
Collector output capacitance Cob (pF)
Switching time ton,tstg,tf (s)
Collector current IC (A)
8
1000
10
10 3 1 0.3 0.1 0.03
tstg 1 ton 0.1 tf
100
10
1 1 3 10 30 100 300 1000
0.01 0 1 2 3 4 5 6 7
0.01 1 3 10 30 100 300 1000
Collector to base voltage VCB (V)
Collector current IC (A)
Collector to emitter voltage VCE (V)
2
Power Transistors
Rth(t) t
10000 Note: Rth was measured at Ta=25C and under natural convection. (1) Without heat sink (2) With a 100 x 100 x 2mm Al heat sink
2SD2000
Thermal resistance Rth(t) (C/W)
1000
100
(1)
10
(2)
1
0.1 10-4
10-3
10-2
10-1
1
10
102
103
104
Time t (s)
3
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(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company.
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A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR

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